The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2001
Filed:
Nov. 10, 1998
Applicant:
Inventors:
Takao Hirayama, Ibaraki-ken, JP;
Kuniaki Sato, Ibaraki-ken, JP;
Toshihiko Ito, Ibaraki-ken, JP;
Toshizumi Yoshino, Ibaraki-ken, JP;
Hiroaki Hirakura, Ibaraki-ken, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/038 ;
U.S. Cl.
CPC ...
G03F 7/038 ;
Abstract
A photosensitive resin composition comprising (A) a photosensitive resin having one or more carboxyl groups, (B) a special epoxy curing agent, and (C) a photopolymerization initiator is excellent in adhesiveness, heat resistance, resistance to PCT and developability and suitable as a solder resist composition.