Stress relief apparatus for an electrical conductor

Abstract

A stress relief apparatus includes a base having a plurality of pins projecting from the base in an axial direction. The pins may have different lengths to accommodate a conductor. Alternatively, spring loaded pins may be used to accommodate the conductor. Spring loaded pins of a common length may be used. The base having a plurality of slots. The base can be mounted to a mounting surface of a printed circuit board or other electrical system. A clip has an engaging surface normal to the axial direction. A latch is attached to the clip. The latch is received by any one of the plurality of slots for detachably mounting the clip to the base in any one of a plurality of heights. Each height provides a respectively different distance between the pins and the engaging surface, such that any one of a plurality of differently sized conductors is gripped between the pins and the engaging surface when the clip is attached to the base, so as to provide stress relief. In one example, the pins are formed of a conductive material, and at least one of the pins projects from a bottom surface of the base for forming an electrical connection between the conductor and a printed circuit board.