The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2001
Filed:
Dec. 09, 1998
Applicant:
Inventor:
Robert Sykes, Tendring, GB;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 3/02 ;
U.S. Cl.
CPC ...
G01N 3/02 ;
Abstract
A test device for applying a tensile force to electrical bond sites of a semiconductor device includes jaws (,), adapted to closely engage the surface of the bond site, typically a solder ball (,), while an inner edge portion (,) of each jaw approaches the jaw axis. By closely confining the bond site, the clamping forces exerted can be increased without risk that the bond site will be crushed. In a preferred embodiment the jaws permit slight reshaping of the bond site to increase the area of engagement therewith.