The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2001

Filed:

Jan. 05, 2000
Applicant:
Inventors:

Akira Yamauchi, Chiba, JP;

Jun Saito, Chiba, JP;

Hiroyuki Maehara, Chiba, JP;

Yuuichi Yamanaka, Chiba, JP;

Assignee:

Chisso Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 2/302 ; C08L 2/310 ;
U.S. Cl.
CPC ...
C08L 2/302 ; C08L 2/310 ;
Abstract

An olefin (co)polymer composition of the present invention comprises 99 to 70 wt. % of olefin (co)polymer (I) and 1 to 30 wt. % of polyethylene-based polymer (II). The olefin (co)polymer (I) comprises 0.01 to 5.0 parts by weight of high molecular weight polyethylene (a) having an intrinsic viscosity &eegr;,measured in tetralin at 135° C. of 15 to 100 dl/g, which is an ethylene homopolymer or an ethylene-olefin copolymer comprising at least 50 wt. % of ethylene polymerization units, and 100 parts by weight of olefin (co)polymer (b) other than the high molecular weight polyethylene. The polyethylene-based polymer (II) has an intrinsic viscosity &eegr;,measured in tetralin at 135° C. of 0.10 to 10 dl/g, which is an ethylene homopolymer or an ethylene copolymer comprising at least 50 wt. % of ethylene polymerization units. Thus, the present invention provides a polypropylene-based olefin (co)polymer composition having excellent formability that is suitable for thermoforming such as vacuum forming and pressure forming, blow molding and foam molding, especially suitable for thermoforming.


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