The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2001
Filed:
Aug. 24, 2000
Applicant:
Inventors:
Toshiyuki Shimazawa, Osaka, JP;
Ichiro Takahara, Osaka, JP;
Assignee:
Matsumoto Yushi-Seiyaku Co., Ltd., Yao, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/502 ;
U.S. Cl.
CPC ...
B32B 1/502 ;
Abstract
A heat-expandable microcapsule comprising a polymer shell formed by polymerizing (I) acrylonitrile, a main monomer component, (II) a monomer having carboxyl and (III) a monomer having groups reactive with the carboxyl of the monomer (II) and of a liquid having a boiling point lower than the softening point of the polymer and being encapsulated in the polymer shell. The heat-expandable microcapsules expand within high temperature range, 240° C. or above, and have heat-resistance.
Shimazawa, Toshiyuki. (2001). Heat-expandable microcapsules, process for producing the same, and method of utilizing the same (U.S. Patent No. 6235394). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6235394
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile