The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2001
Filed:
Feb. 17, 1999
Applicant:
Inventor:
Shoichi Inaba, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 5/00 ;
U.S. Cl.
CPC ...
B24B 5/00 ;
Abstract
A surface of a semiconductor wafer is polished by a polishing pad provided on a rotary polishing table while a polishing slurry is supplied onto a surface of the polishing pad. A surface condition of the polishing pad is regulated by a polishing pad surface mending unit which is provided on an upstream of the wafer in a rotating direction of said polishing table.
Inaba, Shoichi. (2001). Semiconductor wafer polishing device for removing a surface unevenness of a semiconductor substrate (U.S. Patent No. 6234884). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6234884
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile