Packaged integrated, actively aligned with sub-micron accuracy single mode fiber optic connector bulkhead receptacle

Abstract

A method of aligning a photonic device (,) to an optical fiber (,) with sub-micron accuracy. The photonic device packaging assembly (,) includes a housing (,) defining a cavity (,) therein, where the photonic device (,) is mounted within the cavity (,). A single mode fiber (,) having a lensed end (,) is inserted into the cavity (,) to be aligned with the photonic device (,). A fiber (,) extends into a cylindrical ferrule (,) and is soldered therein such that a polished end (,) of the fiber (,) opposite the lensed end (,) is flush with an end to the ferrule (,). The ferrule (,) extends through an opening (,) in the housing (,). A flange (,) is positioned around the ferrule (,) and is welded to an outside wall (,) of the housing (,). An alignment process is used to align the optical fiber (,) to the photonic device (,) with sub-micron accuracy. The fiber (,) is aligned in a Z-direction and then the ferrule (,) is optically welded to the flange (,). Then, the fiber (,) is aligned to the photonic device (,) and the X- and Y-direction, and the flange (,) is optically welded to the housing (,). A connector adaptor (,) is positioned around the flange (,) and the ferrule (,), and is mounted to the housing wall (,) so that the ferrule (,) extends partially into a bore extending through the connector adaptor (,). A connector can be attached to the connector adaptor (,) to attach the photonic device (,) to an optical system.