The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2001
Filed:
Jul. 14, 1999
Kenro Jitsumori, Osaka, JP;
Kenji Furumoto, Osaka, JP;
Shoichi Tanaka, Kyoto, JP;
Tomoyuki Nakayama, Osaka, JP;
Mikiya Mai, Kyoto, JP;
Tugio Murayama, Shiga, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A testing board for testing the electric characteristics of semiconductor integrated circuit elements by applying a voltage to each of the testing electrodes of the semiconductor integrated circuit elements comprises a wiring board having a wiring layer at the surface thereof opposing the semiconductor integrated circuit elements. An elastic sheet is disposed in spaced relation to the opposing surface of the wiring board. Probe terminals are disposed on the surface of the elastic sheet opposing the semiconductor integrated circuit elements to correspond to the testing electrodes. A conductive wire has both end portions joined to the wiring layer of the wiring board and a middle portion spaced from the opposing surface of the wiring board. An elastic member for biasing the conductive wire such that the middle portion of the conductive wire is brought into contact with the probe terminal is disposed between the wiring board and the conductive wire.