The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2001
Filed:
Dec. 04, 1998
David Corisis, Meridian, ID (US);
Walter Moden, Meridian, ID (US);
Mciron Technology, Inc., Boise, ID (US);
Abstract
An interconnect for BGA packages, a BGA package fabricated using the interconnect, and a method for fabricating BGA packages using the interconnect, are provided. The interconnect includes multiple polymer substrates on which patterns of conductors are formed. Each substrate can be used to fabricate a BGA package. The conductors on the substrates include end portions having bonding vias formed therethrough in alignment with access openings in the substrates. During fabrication of the BGA packages, the bonding vias allow the conductors to be bonded to bond pads on semiconductor dice by forming metal bumps on the bonding vias and bond pads. The access openings in the substrates provide access to the bonding vias and bond pads for a bonding tool configured to form the metal bumps. In addition to the bonding vias, the conductors include ball bonding pads configured for attaching ball contacts, such as solder balls, to the conductors and substrates. The completed BGA package includes a substrate adhesively bonded to a semiconductor die; conductors with bonding vias on the substrate; metal bumps in the bonding vias bonding the conductors to bond pads on the die; and an area array of ball contacts attached to the conductors and substrate.