The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2001
Filed:
Apr. 17, 1998
Hiroshi Komorita, Yokohama, JP;
Kazuo Ikeda, Yokohama, JP;
Michiyasu Komatsu, Yokohama, JP;
Yoshitoshi Sato, Yokohama, JP;
Takayuki Naba, Chigasaki, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
There is provided a semiconductor module which comprises a high thermal conductive silicon nitride substrate,having a thermal conductivity of 60 w/m·k or more, a semiconductor element,mounted on this high thermal conductive silicon nitride substrate,, metal circuit plates,which are bonded on the semiconductor element-mounted side of this high thermal conductive silicon nitride substrate,and single metal plate 4,which is bonded to a side opposing to the semiconductor element-mounted side of this high thermal conductive silicon nitride substrate and is bonded on an apparatus casing,or a mounting board. By this constitution, there can be provided a semiconductor module having a simple structure, which can be miniaturized, and having an improved structure strength and an excellent heat cycle resistance property without requiring a heat sink plate or the like.