The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2001
Filed:
Nov. 22, 1996
Seong Jin Kim, Seoul, KR;
Young Sang Baek, Kyungki-do, KR;
LG Electronics Inc., Seoul, KR;
Abstract
A bump electrode is provided for connecting a substrate to an external terminal using an adhesive material including a plurality of conductive elements. The bump electrode includes a pad over the substrate, an electrically conductive bump over the pad for contacting the external terminal through the plurality of conductive elements in the adhesive material, and an insulating layer on a side surface of the electrically conductive bump, the insulating layer substantially covering an entire side surface of the electrically conductive bump to prevent an electrical short through the side surface.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile