The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2001
Filed:
Jun. 10, 1999
Applicant:
Inventors:
Kiyonari Hashidzume, Hino, JP;
Hideaki Nitta, Hino, JP;
Masaki Takeuchi, Hino, JP;
Michio Yamaura, Hino, JP;
Kaoru Iwata, Hino, JP;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 8/04 ;
U.S. Cl.
CPC ...
C08F 8/04 ;
Abstract
Process for producing a hydrogenated &agr;-olefin-dicyclopentadiene copolymer. The process includes a step of distilling of unreacted dicyclopentadiene or tetrahydrodicyclopentadiene which is a hydrogenated product of unreacted dicyclopentadiene from a mixture containing &agr;-olefin-dicyclopentadiene copolymer or its hydrogenated product in the presence of a high-boiling hydrocarbon solvent having a boiling point of 195 to 300° C. and an ignition point of 260° C. or more. Method for melt molding the hydrogenated &agr;-olefin-dicyclopentadiene copolymer is also proposed.