The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2001
Filed:
Sep. 29, 1999
Yoshitake Terashi, Kagoshima-ken, JP;
Shinya Kawai, Kagoshima-ken, JP;
Tetsuya Kimura, Kagoshima-ken, JP;
Hitoshi Kumatabara, Kagoshima-ken, JP;
Yasuhide Tami, Kagoshima-ken, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
Dielectric ceramics comprising a diopside oxide crystal phase, at least one kind of crystal phase selected from the group consisting of a quartz crystal phase and a composite oxide crystal phase containing Ti and Mg or Zn, and a glass phase of an amount of not larger than 30% by weight, said dielectric ceramics having a coefficient of thermal expansion of not smaller than 5.5 ppm/° C. at room temperature to 400° C. and a dielectric loss of not larger than 30×10,at 60 to 77 GHz. The ceramics can be obtained by the co-firing with a low-resistance metal such as copper or silver, and can be advantageously used for the production of wiring boards to which the signals of particularly high frequencies are applied. The ceramics has a large coefficient of thermal expansion which can be brought close to the coefficient of thermal expansion of the semiconductor element such as of GaAs or of the printed board. The wiring board produced by using the ceramics effectively prevents breakage in the mounting portion of the wiring board that is caused by a difference in the thermal expansion.