The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2001

Filed:

Mar. 24, 1999
Applicant:
Inventors:

Chil-kun Pong, Suwon, KR;

Joo-hyun Jin, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1311 ;
U.S. Cl.
CPC ...
H01L 2/1311 ;
Abstract

A method of fabricating a contact window of a semiconductor device, whereby a contact window of a semiconductor device is increased to offset any incline phenomenom and avoid unwanted increase in contact sheet resistance, comprises forming a lower conductive member on a semiconductor substrate, forming a first insulative film on the lower conductive member, the first insulative film being formed of an insulative material doped with impurities at a first level of concentration, the first insulative film having a wet etch rate that is proportional to the level of concentration of impurities, forming a second insulative film on the first insulative film, the second insulative film being formed of an insulative material doped with impurities at a second level of concentration that is lower than the first level of concentration of impurities, the second insulative film also having a wet etch rate that is proportional to the level of concentration of impurities, opening a contact window and exposing the lower conductive member by dry etching the second and first insulative films, and wet etching the second and first insulative films through which the contact window has been formed to increase an exposed area of the lower conductive member.


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