The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2001
Filed:
Jun. 04, 1998
Sanjay Mitra, Colorado Springs, CO (US);
Vic Lau, Chaun Park, SG;
Ramtron International Corporation, Colorado Springs, CO (US);
Abstract
A plastic package assembly method suitable for ferroelectric-based integrated circuits includes a strict thermal budget that reduces the time at temperature for four key processing steps: die attach cures, die coat cures, molding cures, and marking cures. The plastic package assembly method uses low temperature mold and die coat materials, as well as low temperature curable inks or laser marking in order to minimize degradation of electrical performance, thus improving yields and reliability. The assembly method uses a snap cure die attach step, a die coat followed by a room temperature cure, and formation of the plastic package with room temperature curable molding compounds not requiring a post mold cure. Front and back marking of the plastic package is accomplished using either an infrared or ultraviolet curable ink followed by minimum cure time at elevated temperature, or by using laser marking.