Method for manufacturing semiconductor device with pad structure

Abstract

A semiconductor device equipped with secondary pads having adequate arrangement for an arbitrary packaging process. The secondary pads are connected with the primary pads of the semiconductor device with a novel lead wire structure, which is characterized by its low electric resistance, good mechanical strength to protect active components of the device, good adhesion to bumps, and anti-electromigration property. The semiconductor device has: semiconductor circuit elements,embedded in a semiconductor substrate,; a plurality of conductive primary pads,each formed in a region above, and surrounding, the circuit element,; a first protective insulation substrate,covering the substrate and having first openings,for the primary pads,; lead wires,each consisting of a conductive bulk layer,made of copper and a metallic top layer,the bulk layer formed on the first protective insulation substrate,and having one end connected with a corresponding one of the primary pads,through an associated opening,and the other end located in a region surrounding the opening,, while the top layer made of a metal having Vickers hardness of more than 100; and a second protective insulation substrate,having second openings,for exposing the top surfaces of the other ends of the lead wires,serving as the secondary pads