The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2001
Filed:
Jan. 06, 1999
Yoshihiko Nakamura, Kadoma, JP;
Masahiro Matsumura, Kadoma, JP;
Narimasa Iwamoto, Kadoma, JP;
Hidetsugu Motobe, Kadoma, JP;
Yukio Hatta, Kadoma, JP;
Matsushita Electric Works, Ltd., Osaka, JP;
Abstract
An epoxy resin composition featured in containing, in a matrix of an epoxy resin having more than two epoxy groups in each molecule, a phenolic hardening agent having more than two phenolic hydroxyl groups in each molecule, an organobis(N-dialkylurea) hardening promotion agent, a solvent for the hardening promotion agent, and a guanamine compound, and capable of obtaining a prepreg excellent in the preservation stability and, less causing a solvency errosion (halo phenomenon) due to an infiltration of plating solution along boundaries between a printed copper circuit formed in an inner-layered circuit board and a resin forming the prepreg, is realized.