The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2001

Filed:

Sep. 22, 1998
Applicant:
Inventors:

Dinesh Gupta, Hopewell Junction, NY (US);

L. Wynn Herron, Hopewell Junction, NY (US);

John U. Knickerbocker, Hopewell Junction, NY (US);

David C. Long, Wappingers Falls, NY (US);

Jawahar P. Nayak, Wappingers Falls, NY (US);

Robert A. Rita, Wappingers Falls, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/126 ;
U.S. Cl.
CPC ...
B32B 3/126 ;
Abstract

In the formation of multilayer ceramic substrates, greensheets are utilized which have the same pattern and number of vias punched in each greensheet. Then, selected vias may be filled with metallic paste to form the internal connections of the multilayer ceramic substrate. The remaining vias may be filled with a fugitive material or left totally unfilled. Also disclosed is the multilayer ceramic substrate produced by this method.


Find Patent Forward Citations

Gupta, Dinesh. (2001). Method of forming a multilayer ceramic substrate with max-punched vias (U.S. Patent No. 6231707). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6231707

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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