The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2001
Filed:
Feb. 17, 1999
Richard W. Sexton, Huber Heights, OH (US);
James E. Harrison, Jr., Dayton, OH (US);
Scitex Digital Printing, Inc., Dayton, OH (US);
Abstract
A method is provided for fabricating a flexible circuit having at least one raised bump associated with a contact pad. A sacrificial conductive mandrel is provided having a depression located to correspond with each raised bump contact. A conductive metal pattern is electroformed on selected portions of the sacrificial conductive mandrel, corresponding to a desired electrical lead pattern and the contact pad. A non-conductive polymeric sheet is applied as a base material for the flexible circuit, and laminated to the sacrificial conductive mandrel on the face having the conductive metal pattern thereon. An etchant, capable of removing the sacrificial conductive mandrel without etching or removing metal of the conductive metal pattern, is employed to remove the sacrificial conductive mandrel from the polymeric sheet to which the mandrel and the conductive metal pattern are laminated.