Contactor floor that holds an ic package to contactor pins within an ic package testing system with minimized solder flaking

Abstract

A mechanism for positioning and coupling an integrated circuit package to a system for testing the integrated circuit package with minimized solder flaking. A contactor floor holds the integrated circuit package for moving the integrated circuit package within the system for testing the integrated circuit package. A respective contactor pin couples a corresponding lead of the integrated circuit package to the system for testing the integrated circuit package when the contactor floor moves the integrated circuit package to a testing position. The respective contactor pin further includes a positioning protrusion that protrudes toward a side wall of the contactor floor and that slides along the side wall of the contactor floor when the contactor floor is moving the integrated circuit package toward and away from the testing position with respect to the respective contactor pin. In addition, the respective contactor pin includes a contacting protrusion that is disposed above the positioning protrusion on the respective contactor pin and that protrudes toward the side wall of the contactor floor. An axis of the respective contactor pin is bent away from the side wall of the contactor floor at an angle such that the contacting protrusion is separated from the corresponding lead of the integrated circuit package with at least a predetermined avoidance distance when the contactor floor is moving the integrated circuit package toward and away from the testing position with respect to the respective contactor pin. With such a separation, the contactor pin does not scrape along the corresponding lead of the IC package to result in minimization of solder flaking.