The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2001
Filed:
Mar. 29, 2000
Shrikar Bhagath, San Jose, CA (US);
Alexander C. Tain, Milpitas, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A flip chip package compatible with first and second die footprints includes an interconnection substrate having a connection surface configured to receive an integrated circuit die that has either a first or a second die footprint. The interconnection substrate has a plurality of conductive pads on its connection surface for establishing a connection to the conductive pads of the selected integrated circuit die. The connection surface conductive pads have a first section corresponding to the conductive pads of an integrated circuit with a first die footprint. It also has a second section corresponding to the conductive pads of an integrated circuit with a second die footprint. The first and second sections of conductive pads overlap, reducing the size of the package footprint while allowing the same package to be used with different integrated circuit dies.