The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2001
Filed:
Aug. 20, 1998
Applicant:
Inventor:
Paul Schwab, Hudson, NH (US);
Assignee:
The Whitaker Corporation, Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract
A packaged integrated circuit configured for interconnection to an external component comprises a die (,) having a high frequency contact (,), the die (,) being disposed on a lead frame (,). The lead frame (,) comprises a plurality of leads (,). At least two of the leads are first and second RF port leads (,) which are electrically connected to the high frequency contact (,). When mounted to a printed circuit board substrate, there is a capacitor (,) connected between the first and second RF port leads (,) to achieve frequency specific signal attenuation at an unwanted frequency with minimal contribution of insertion loss at a desired frequency.