The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2001
Filed:
Jan. 19, 1999
Applicant:
Inventors:
Chyi-Shan Wang, Beavercreek, OH (US);
Jar-Wha Lee, Hilliard, OH (US);
Richard A. Vaia, Dayton, OH (US);
Assignee:
The University of Dayton, Dayton, OH (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K 3/10 ;
U.S. Cl.
CPC ...
C08K 3/10 ;
Abstract
A method is provided for forming a highly conductive metal-containing polymer fiber or sheet in which a polymer is immersed in a solution containing a metal precursor selected from organic or inorganic salts of copper, silver, aluminum, gold, iron and nickel. The metal precursor is then reduced by chemical, electrochemical, or thermal means such that conductive metal is incorporated into the polymer.