The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2001
Filed:
Nov. 02, 1998
Applicant:
Inventors:
Christy Mei-Chu Woo, Cupertino, CA (US);
Young-Chang Joo, Sunnyvale, CA (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1302 ;
U.S. Cl.
CPC ...
H01L 2/1302 ;
Abstract
Cu metalized wafers are stored at elevated temperatures to substantially complete recrystalization, thereby enabling subsequent CMP with a high degree of wafer to wafer uniformity. Embodiments include electroplating or electroless plating Cu or a Cu alloy to fill one or more damascene openings in a plurality of wafers, placing the wafers in one or more cassettes, and storage-annealing the cassettes on shelves of a cabinet maintained at about 50° C. to about 200° C. in nitrogen for about 2 minutes to about 3 days.