The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2001
Filed:
May. 04, 1998
Applicant:
Inventors:
Gong Chen, Gilbert, AZ (US);
Robert D. Colclasure, Mesa, AZ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/176 ;
U.S. Cl.
CPC ...
H01L 2/176 ;
Abstract
A semiconductor wafer (,) includes a first semiconductor die (,) having a first alignment mark (,) disposed in an alignment region (,) to align the first semiconductor die on the wafer. A second semiconductor die (,) has a second alignment mark (,) disposed in the alignment region such that the second alignment mark overlaps the first alignment mark. The area occupied by the overlapping alignment marks is shared between the first and second semiconductor dice to reduce the area and the cost of each die.