The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2001
Filed:
Feb. 02, 1998
Hideo Ohta, Tokyo, JP;
Tetsuo Okuyama, Yokohama, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A method of manufacturing a resin-encapsulated semiconductor device, which includes the steps of, mounting a semiconductor element facedown on a substrate provided with a wiring circuit with a main surface of the semiconductor element being faced to the substrate, positioning the substrate bearing the semiconductor element in a mold together with a sealing resin, and applying a pressure onto the sealing resin to move the sealing resin to a space between the semiconductor element and the substrate, to the sides of the semiconductor element and to the bottom surface of the semiconductor element, thereby sealing the semiconductor element with the sealing resin.