The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2001

Filed:

Apr. 09, 1999
Applicant:
Inventors:

Hidenori Taguchi, Tokyo, JP;

Keishiro Umemura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29B 7/16 ; B29B 7/44 ; B29C 4/500 ; B29C 4/700 ;
U.S. Cl.
CPC ...
B29B 7/16 ; B29B 7/44 ; B29C 4/500 ; B29C 4/700 ;
Abstract

A manufacturing method of a simulated wood product utilizing pulverized powders obtained from recycled building members as raw material, in which the building members have recycled wooden members made of wooden materials and resinous members made of resinous materials, the manufacturing method further including a mixing process for mixing the recycled wooden members, a pulverization process for pulverizing the mixed materials obtained in the mixing process to form pulverized powder, a kneading process for kneading the pulverized powders obtained by the pulverizing process, and a molding process for molding the kneaded materials obtained in the kneading process either by an extrusion or injection molding.


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Taguchi, Hidenori. (2001). Cement bonded wood chip product, resin bonded wood chip product, simulated wood product and manufacturing method thereof (U.S. Patent No. 6228301). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6228301

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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