The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2001
Filed:
Mar. 23, 1999
Applicant:
Inventors:
Satoshi Tanikawa, Shizuoka-ken, JP;
Takashi Ishii, Shizuoka-ken, JP;
Assignee:
Yazaki Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 4/300 ;
U.S. Cl.
CPC ...
H01R 4/300 ;
Abstract
In this method, a ground wire,is overlaid on a shield wire,in cross. Next, overlapping portions of the shield wire,and the ground wire,are interposed between an upper resin tip,and a lower resin tip,. By executing a first ultrasonic oscillation while inserting a projection,of an ultrasonic horn,into a through hole,of the tip,, outside rinds,of the wires,are removed in the vicinity of the overlapping portions. Next, by arranging a low-melting metal,and a resin piece,on a contact between the braided wire,and the core line,and executing a second ultrasonic oscillation, the contact can be brazed with the mutual welding of the tips