The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2001
Filed:
Jul. 02, 1999
Applicant:
Inventor:
Ming-Tung Shen, Taipei, TW;
Assignee:
CTS Computer Technology System Corporation, Taipei, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
An integrated circuit packaging structure, which can accommodate two or four memory chips in a single package. The feature rests upon a packaging structure that makes independent data buses between two memory chips, while implementing in parallel the address buses and control buses, and finally encapsulates them within one package in the expectation of doubling the memory capacity without increasing the size of the package and the number of pins.
Quick Actions:
Shen, Ming-Tung. (2001). Integrated circuit packaging structure (U.S. Patent No. 6225691). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6225691
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile