The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2001
Filed:
Apr. 05, 2000
Robert Newman, Santa Clara, CA (US);
Chu-Chung Stephen Lee, Santa Clara, CA (US);
Melissa Siow-Lui Lee, San Jose, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
Wire sweep/crossing during resin molding is significantly reduced or prevented by reducing the gap spacing between corner lead pins and the tie bars of a die-attach pad. Embodiments of the present invention include spacing the tie bars from the corner lead pins by a distance no greater than about 18 mils, e.g., about 4 to 12 mils. Embodiments of the present invention also comprise a lead frame wherein the inner ends of the lead pins are arranged in a substantially planar array to define a substantially circular region surrounding the die-attach pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile