The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2001

Filed:

Sep. 07, 1999
Applicant:
Inventors:

Surasit Chungpaiboonpatana, Irvine, CA (US);

Craig Davidson, Foothill Ranch, CA (US);

Assignee:

Conexant Systems, Inc., Newport Beach, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/358 ; H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/358 ; H01L 2/348 ;
Abstract

An improved microelectronic interconnect structure and methods for forming the structure are disclosed. The microelectronic interconnect structure includes an organic-based coating that facilitates formation of electrical connections to the structure. The coating may be used to reduce oxidation of copper interconnects, which allows wire or bump attachment to the copper interconnect using conventional wire bonding or bump interconnect methods and apparatus. The coating is applied during a post chemical mechanical polishing process by placing the interconnect structure into a solution.


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Chungpaiboonpatana, Surasit. (2001). Microelectronic interconnect structures and methods for forming the same (U.S. Patent No. 6225681). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6225681

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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