The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2001

Filed:

Feb. 19, 1999
Applicant:
Inventors:

Jeffrey L. Bream, Bethlehem, PA (US);

Stephen A. Ferranti, Rowlett, TX (US);

Madhu Ganesa-Pillai, Dallas, TX (US);

Leon Klafter, Allen, TX (US);

Alan M. Lyons, New Providence, NJ (US);

John Paul Mello, Dallas, TX (US);

Steven J. Vargo, Midlothian, TX (US);

Assignee:

Lucent Technologies Inc., Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 ; H05K 1/09 ; H05K 3/30 ;
U.S. Cl.
CPC ...
H05K 1/18 ; H05K 1/09 ; H05K 3/30 ;
Abstract

The present invention provides a heatsink for use with a heat-generating electrical component. The heatsink comprises a spine having opposing sides, cooling fins extending from the spine, and a dielectric layer adhered to at least one of the opposing sides. The dielectric layer has a thermal conductivity of at least about 1 W/m° C. The heatsink may further comprise a metal layer adhered to the dielectric layer. The metal layer provides a surface to which an electric component can be adhered. The heatsink can further include a heat-generating component adhered to the metal layer. In another aspect, the heat-generating component is a surface-mount electrical component adhered to the metal layer with solder.


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