The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2001
Filed:
Nov. 14, 1997
Applicant:
Inventors:
Hiroyuki Hashimoto, Kasugai, JP;
Kazuhisa Sato, Kounan, JP;
Assignee:
NGK Spark Plug Co., Ltd., Aichi-ken, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 ;
U.S. Cl.
CPC ...
H05K 1/16 ;
Abstract
A wiring substrate to which an IC chip is connected through soldering is formed from ceramic having electrode pads formed of a metallization layer. At least one nickel layer is formed on the electrode pads. The nickel layer has a thickness in the range of 2.5 &mgr;m to 8 &mgr;m. The nickel layer is preferably composed of a plurality of plated layers, and the outermost layer thereof is preferably formed through Ni-B plating. A gold plating layer is preferably formed on the outermost nickel layer. Further, heating is advantageously performed at least one time during the formation of the plurality of nickel layers.