The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2001
Filed:
Jul. 27, 1999
Applicant:
Inventors:
Kazuo Watada, Sendai, JP;
Yoichi Fujioka, Sendai, JP;
Hiroko Tanda, Kokubu, JP;
Koji Enokida, Kokubu, JP;
Saeki Nakamura, Sendai, JP;
Assignee:
Kyocera Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/00 ;
U.S. Cl.
CPC ...
C08K 3/00 ;
Abstract
A composite resin and fillers for molding electronic and structural parts that have high dimensional accuracy, are free of surface defects stemming from the mold and are suitable for mass production. The preferred composite contains 10 to 70 vol-% of a thermosetting resin with the balance consisting of filler particles having an average diameter of 40 &mgr;m or less. The final molded article has pores of 15 to 80 &mgr;m in diameter occupying between 3 and 30% of the area of a cross-section.