The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2001

Filed:

Feb. 13, 1998
Applicant:
Inventor:

Hisashi Ueno, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F 1/02 ;
U.S. Cl.
CPC ...
C23F 1/02 ;
Abstract

A polishing apparatus can stabilize polishing speed at the peripheral end portion of a polishing object, such as a wafer for fabricating a semiconductor device. The polishing apparatus performs polishing by arranging the polishing object in opposition to an abrasive cloth on a rotary polishing table, applying a load on a polishing block and with supplying a polishing fluid. A ring-shaped retainer is provided for embracing a given thickness of a elastic buffering plate provided between the polishing object fixing block and the polishing object for making contact pressure between the polishing object and the abrasive plate uniform and whereby for making a polishing speed of the polishing object constant.


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