The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2001
Filed:
May. 28, 1998
Peter Doikas, Arlington Heights, IL (US);
David Geis, Niles, IL (US);
Jeffrey D. Merwin, Buffalo Grove, IL (US);
Osram Sylvania Inc., Danvers, MA (US);
Abstract
A method (,) for providing an electrical ground connection between a printed circuit board (,) and a metallic substrate (,) comprises the steps of: (i) providing an aperture (,) in the substrate (,); (ii) forming a ground plug (,) out of a metallic blank (,); (iii) inserting the ground plug (,) into the aperture in the substrate (,); (iv) compressing the ground plug (,) into the aperture (,) in the substrate (,); (v) placing the printed circuit board (,) onto the substrate (,); and (vi) applying solder into the aperture in the printed circuit board (,) and onto the ground plug (,). The steps of forming (,), inserting (,), and compressing (,) are carried out in a single punching operation (,). The method (,) efficiently provides a high quality electrical ground connection and avoids any need for sophisticated machinery.