The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2001
Filed:
May. 28, 1999
Steve M Danziger, Manassas, VA (US);
Tushar Shah, Columbia, MD (US);
Lockheed Martin Corporation, Bethesda, MD (US);
Abstract
Wire bond pad and solder ball or controlled collapse chip connections C,are combined on a planar surface of a an integrated circuit device to provide a die. Known good die (KGD) testing is optionally performed using wire bond connections or stress tolerant solder ball connections. The KGD testing is conducted after the integrated circuit dies are diced from a wafer. Solder ball or C,array connections which withstand thermal stress are used to KGD test the die prior to final use of the wire bond pad connections to an end use device. Alternatively, wire bond pads are used to test the die while maintaining the solder ball or C,array in a pristine condition for bonding to a final end product device. Both testing with the solder ball C,array contacts and with the wire bond connections provides metallurgical connections for the KGD test. The solder ball or C,array is connected to the wire bond pads and either connection can be used to burn-in test the die.