The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2001
Filed:
Aug. 30, 1999
Kevin Joseph Hawes, Greentown, IN (US);
David Jay Vess, Kokomo, IN (US);
Dwadasi Hare Rama Sarma, Kokomo, IN (US);
Bradley Howard Carter, Kokomo, IN (US);
Jerome Anthony Schneider, Kokomo, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A method by which a conventional circuit trace (,) is modified with a layer (,) of high-conductivity solder alloy to yield a high-current circuit trace (,) for high-current routing on a substrate (,). The method generally entails the use of a solder composition that contains a dispersion of metal particles (,) in a solder alloy (,). The metal particles (,) are selected on the basis of having a higher electrical conductivity than the solder alloy (,), and are present in sufficient amounts so that the electrical conductivity of the solder composition is significantly higher than that of the solder alloy (,). The solder composition is deposited on a conductor (,), and then reflowed to form a conductive layer (,) on the conductor (,). The metal particles (,) remain as a discrete dispersion within the conductive layer (,) in order to suitably promote the conductivity of the layer (,). The solder composition is preferably deposited in an amount sufficient to increase the current-carrying capacity of the resulting circuit trace (,) for high-current routing on the substrate (,), e.g., in excess of six amps.