The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2001
Filed:
Sep. 09, 1999
Applicant:
Inventors:
Marcel Heerman, Merelbeke, BE;
Hubert de Steur, Drongen, BE;
Assignee:
Siemens S.A., Brussels, BE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 ;
U.S. Cl.
CPC ...
H05K 3/00 ;
Abstract
In order to form metallic conductor patterns having connection regions that can be soldered and/or bonded on electrically insulating substrates, firstly a metalization is applied to the substrate and is then removed again, at least in those regions adjoining the desired conductor pattern. There then follows the electrolytic deposition of a final surface which can be soldered and/or bonded to the connection regions. Clean-room conditions are not necessary.
Quick Actions:
Heerman, Marcel. (2001). Method for forming metal conductor patterns on electrically insulating substrates and supports (U.S. Patent No. 6221229). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6221229
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile