The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2001
Filed:
Feb. 09, 1999
Yoshio Makita, Mobara, JP;
Nobuhiko Takashima, Mobara, JP;
Katsunosuke Ozawa, Mobara, JP;
Tatsuo Yamaura, Mobara, JP;
Satoshi Yoshikata, Mobara, JP;
Masayuki Itakura, Mobara, JP;
Futaba Denshi Kogyo Kabushiki Kaisha, Mobara, JP;
Abstract
An automatic support pillar transfer mechanism is provided that enables an enlarged transfer range, reduced produce failure and mass-production. The touch sensors,to,are arranged on the moving section,to measure the plane orientation of the surface of the jig,The jig adjusting section,is driven based on the measurement results on the plane orientations of surfaces of the jig,to adjust the surface of the jig,in parallel. With plural support pillars,sucked and held at predetermined intervals by the jig,adjusted in parallel, the bonding agent coated substrate 14 attached on the moving section,is descended to coat the bonding agent,onto the one ends of the support pillars,The substrate,to which the support pillars,are transferred is attached to the moving section,Variations in plane orientation of surfaces of the substrate,are respectively measured by means of the touch sensors,to,The jig adjusting section,is driven according to the variations in plane orientation of the surfaces of the substrate,With the surface of the jig,arranged in parallel to the surface of the substrate,the moving section,is descended to transfer the support pillars,onto the surface of the substrate