The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2001
Filed:
Oct. 14, 1997
Shin Ishimatsu, Yokohama, JP;
Haruhiko Terai, Yokohama, JP;
Masafumi Takimoto, Tokyo, JP;
Akira Goto, Yokohama, JP;
Junji Tatsumi, Kawasaki, JP;
Hiroshi Koshikawa, Kawasaki, JP;
Toshinori Hasegawa, Yokohama, JP;
Ken Ikegame, Tokyo, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A liquid jet recording head comprises a first substrate having a plurality of discharge energy generating devices formed thereon, and a second substrate having a discharge opening plate provided with a plurality of discharge openings for discharging ink, and recessed portions becoming ink flow paths conductively connected with said discharge openings, and a common liquid chamber for retaining ink to be supplied to each of said discharge openings, respectively. The ink flow paths and common liquid chamber are formed by joining the first substrate and second substrate with the discharge energy generating devices of the first substrate facing the recessed portions becoming ink flow paths of the second substrate, at the same time, the joint between the first substrate and second substrate being sealed by sealing compound, and fine grains inclusively residing on the joint between the first substrate and second substrate. With the liquid jet recording head thus structured, there is no possibility that sealing compound flows into the ink flow paths and discharge openings even if the joint between the first and second substrates are sealed by sealing compound, and that any defective prints take place. The production yield in the sealing step of manufacture is increased, at the same time, the controlling burden is lightened.