The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2001
Filed:
Jun. 19, 1998
Stanley I. Tsunoda, Encinitas, CA (US);
Thomas M. Bohanon, San Diego, CA (US);
Mervyn H. Horner, Del Mar, CA (US);
Lawrence D. Woolf, Carlsbad, CA (US);
General Atomics, San Diego, CA (US);
Abstract
Improved methods and techniques for fabricating a panel of control cells, or a “control panel”, useful in various electromagnetic turbulence control (EMTC) applications includes a layered structure which includes three main components or layers: a metal substrate or backing plate having a high magnetic permeability; a ribbed magnetic structure attached to the metal substrate; and an electrode board bonded to the ribs of the magnetic structure. The ribbed magnetic structure is realized, in one embodiment, by a series of rare earth permanent magnets placed side-by-side using a bowed tool to create permanent magnet columns. The magnet columns thus formed are precisely positioned and glued to the substrate or backing plate so as to form parallel magnetic ribs. An electrode board, similar to a printed circuit board, is then bonded to the ribs of the magnet columns, e.g., so that a back side of such electrode board rests on top of the magnetic columns or ribs. The electrode board includes a matrix of electrodes formed on its front surface. The boards are constructed in such a way that the electrodes are protected from exposure to corrosive elements. Electrical access to the electrodes is made from the back surface of the electrode board and, via access holes provided through the backing plate, from behind the backing plate.