The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2001
Filed:
Jan. 19, 1999
Applicant:
Inventors:
Uwe Benz, Uhldingen-Muehlhof, DE;
Lothar Haug, Esslingen, DE;
Wolfgang Kleinekathoefer, Waldstetten, DE;
Peter Waitkat, Neuhausen, DE;
Assignee:
Xcellsis GmbH, Kirchheim, DE;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/20 ;
U.S. Cl.
CPC ...
B23K 1/20 ;
Abstract
In method for soldering metal microstructured plates, stacks of plates and solder layers are prepared by placing the solder layers between each adjacent plate. The thickness of the solder layers range from 3 to 25 &mgr;m. The stack is then soldered by heating it in a vacuum or an inert atmosphere.