The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2001

Filed:

Dec. 21, 1998
Applicant:
Inventors:

Kiyoshi Shimizu, Tanashi, JP;

Yoshihiro Ishida, Tanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/32 ;
U.S. Cl.
CPC ...
H05K 3/32 ;
Abstract

The shapes of openings of a solder resist defining exposed portions of electrode pads and the shapes of openings of the solder resist defining the shapes of positioning signs are simultaneously formed by photolithography using the same mask pattern. As a result, the signs for registration can be easily formed on a main board or circuit boards. Also, it is possible to increase the positional accuracy of the signs relative to the positions of the electrode pads.


Find Patent Forward Citations

Shimizu, Kiyoshi. (2001). Method for manufacture electronic component device (U.S. Patent No. 6219912). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6219912

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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