Chip-to-board connection assembly and method therefor

Abstract

The chip-to-board (or chip-to-MCM) connection assembly and method therefor features a semiconductor chip (,) having a front surface (,) on which external terminal pads are provided; a board or MCM (,) having a surface (e.g., a recessed surface) at a first side thereof to which the rear surface (,) of the chip is affixed; and a connection carrier (,), disposed as an overlay, which electrically links the chip and the board or MCM. In this assembly scheme, the connection carrier (e.g., a bump carrier) which is affixed to both the chip and the board or MCM, contains all required signal line tracings (,) to provide the electrical interconnection between the semiconductor chip and the board or MCM. The bump carrier replaces all bond wires (,) and the like and can include support/control circuitry, passive and/or active, associated with, for example, high-speed/high-power IC chips (,). The connection carrier (,) is provided with the electrical contacts (,) such as bump electrodes each interconnecting a contact location (,) at the surface side of the connection carrier facing the semiconductor chip and the oppositely disposed (i) external pad on the chip or (ii) external pad or landing (,) at a side of the board (,) facing the connection carrier (,). Heat generated during operation is released through the rear side of the semiconductor chip (,), which is affixed to the board or MCM (,).