The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2001
Filed:
Jan. 06, 1999
Applicant:
Inventor:
Masanobu Nogome, Bizen, JP;
Assignee:
Matsushita Electronics Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 3/1072 ; H01L 3/1109 ; H01L 3/10328 ; H01L 3/10336 ;
U.S. Cl.
CPC ...
H01L 3/1072 ; H01L 3/1109 ; H01L 3/10328 ; H01L 3/10336 ;
Abstract
A semiconductor device includes two or more semiconductor elements provided on a semi-insulating substrate with a buffer layer and an interlevel film being interposed therebetween, an element isolating portion provided as a result of forming a groove between the two or more semiconductor elements through the buffer layer and the interlevel film so as to reach the semi-insulating substrate, and a protective film for protecting at least ends of the buffer layer in the vicinity of the element isolating portion.