The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2001
Filed:
Dec. 08, 1999
Takumi Kikuchi, Tokyo, JP;
Hirofumi Fujioka, Tokyo, JP;
Toshiyuki Kikunaga, Tokyo, JP;
Hirotaka Muto, Tokyo, JP;
Shinichi Kinouchi, Tokyo, JP;
Osamu Usui, Tokyo, JP;
Takeshi Ohi, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
An object is to obtain long-term reliability of an electric connection in a power semiconductor module. In a power semiconductor module, the main circuit interconnection directly connected to a power semiconductor chip (,) is formed of a busbar (,) and the power semiconductor chip (,) and the busbar electrode (,) of the busbar (,) are electrically connected through a conductive resin (,). A member (,) having lower thermal expansion than the busbar electrode (,) is joined to the busbar electrode (,) in the part adjacent to said power semiconductor chip (,).