The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2001
Filed:
Oct. 29, 1998
Masao Goto, Oita-ken, JP;
Yuji Fukuzawa, Yokohama, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
The semiconductor device comprises an insulating film having a device hole; inner leads disposed on one main face of the insulating film; a semiconductor element, which is mounted on the insulating film and connected to the ends of the inner leads; and a resin-encapsulating layer for covering such connections and the like, wherein the device hole of the insulating film has a flat shape externally protruded in the neighborhood of the middle on the short side, and a length of the long side containing the projections is larger than the corresponding length of the semiconductor chip. The expansion of the resin-encapsulating layer coated on the insulating film has a length on the short side of the semiconductor element larger than that on the long side. In a semiconductor device having the UNT structure in particular, a strength of adhesive between the resin-encapsulating layer and the insulating film on the short sides of the semiconductor chip is improved, a crack is prevented from being caused, and high reliability in connection can be obtained.