The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2001
Filed:
Jul. 15, 1998
Yukihiko Sasaki, Claremont, CA (US);
Jesse C. Ercillo, Covina, CA (US);
Catharina Eyken, Alphen aan de Rijn, NL;
Le Hoa Hong, Monterey Park, CA (US);
Henk de Koning, Zevenhuizen, NL;
Avery Dennison Corporation, Pasadena, CA (US);
Abstract
An improved hot-melt pressure-sensitive adhesive (HMPSA) composition contains an elastomeric component, such as a blend of SIS and SB block copolymers, and a tackifying component comprising one or more intermediate softening point resins (ISPRs) having a ring and ball softening point of from 35 to 60° C. The improved adhesive compositions are characterized by reduced volatility, less bleed and staining tendencies, and improved overall adhesive performance. The invention also provides improved label constructions in which a release liner is coated with an HMPSA composition and laminated to a flexible facestock. Notably, even when low basis weight paper facestocks are used, the construction can be converted at high speeds.