The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2001
Filed:
Jan. 20, 1998
Applicant:
Inventors:
Masayuki Tanaka, Nagoya, JP;
Yumiko Tsurumi, Kawasaki, JP;
Assignee:
Toray Industries, Inc., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 6/300 ; C08J 3/24 ;
U.S. Cl.
CPC ...
C08L 6/300 ; C08J 3/24 ;
Abstract
An epoxy resin composition to seal semiconductors constructed of a semiconductor element, a base to support said semiconductor element, and an epoxy resin composition covering only one side opposite to the base, said epoxy resin composition comprising (A) epoxy resin, (B) hardener, and (C) inorganic filler, and giving a cured product which has (a) a flexural modulus of elasticity of 10 to 30 GPa at 23° C. and (b) a coefficient of linear expansion of 4×10,/K to 10×10,/K in the temperature range from 23° C. to the glass transition point, with the product of (a) and (b) being smaller than 2×10,GPa/K.